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Technical capability

Click rate:  Add:2017-02-22 17:53:46   Category:Technical

 

      

Project

Capability

1

 Layers 

216 layers 

2

 Board thickness 

0.40mm--3.20mm (16--126mil)

3

 Min trace width/space

0.075mm/0.075mm

(Base copper thickness:  Hoz)(3mil/3mil)

4

Base copper thickness

Inner layers (Hoz—6oz)(UL approval ) 

Outer layers (Hoz—6oz)(UL approval ) 

5

 Min hole diameter

0.15mm(6mil) 

6

Min Copper thickness in hole

20~70um 

7

 PTH size tolerance 

±0.08mm-±0.05mm(±3mil-±2mil) 

8

 NPTH size tolerance 

±0.05mm-±0.025mm(±2mil-±1mil) 

9

Hole position tolerance

±0.05mm(2mil)

10

 Dimension tolerance  

±0.1mm(4mil)

11

Min solder mask dam  

0.08mm(3mil) 

13

Aspect ratio 

10 : 1

14

Board twist and wrap 

≤0.75%

15

Plug hole diameter

0.20—0.60mm(8mil—24mil)

16

Impedance control 

±10%

17

Surface finish

LF-HSAL(SnNiCu&SnAgCu), OSP, HASL,  Immersion Gold (finished inside)

Immersion Tin, Immersion Ag (finished by subcontractor)

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